Compact and Low-loss Optical Transformers and Tunnel Vias for 3D Photonic Integrated Circuits

Abstract: In this seminar, a novel design of silicon photonic optical tunnel via (OTV) suitable for 3D photonic integration will be presented. Then in beginning a comprehensive review of existing vertical coupling approaches like grating-assisted, evanescent, tapered, and optical via structures highlights the limitations in bandwidth, compactness, and CMOS compatibility. To address these challenges, a multilayer photonic platform incorporating optical tunnel vias (OTVs) is proposed. The architectural design, simulation methodology, and performance evaluation of the OTV-based platform are presented, emphasizing insertion loss, mode evolution, and power distribution across layers. The results demonstrate the potential of the proposed approach for scalable, broadband, and CMOS-compatible 3D photonic integration.

Event Details
Title: Compact and Low-loss Optical Transformers and Tunnel Vias for 3D Photonic Integrated Circuits
Date: November 24, 2025 at 3:00 PM
Venue: CSD-308 & online link http://meet.google.com/bxq-itrx-znx
Speaker: Mr. SARAD SUBHRA BHAKAT (EE23S201)
Guide: Dr. Bijoy Krishna Das
Type: MS seminar